TSMC to Initiate 1.4nm Process Technology R&D

At processor manufacturers, fundamental and applied research and development work never stops, so now that Taiwan Semiconductor Manufacturing Co. has outlined a timeline for its N2 (2 nm-class) fabrication process that will enter high-volume manufacturing (HVM) in 2025, it is time for the company to start thinking about a succeeding […]

At processor manufacturers, fundamental and applied research and development work never stops, so now that Taiwan Semiconductor Manufacturing Co. has outlined a timeline for its N2 (2 nm-class) fabrication process that will enter high-volume manufacturing (HVM) in 2025, it is time for the company to start thinking about a succeeding node. If a new rumor is to be believed, TSMC is set to formally announce its 1.4 nm-class technology in June. 

TSMC plans to reassign the team that developed its N3 (3 nm-class) node to development of its 1.4 nm-class fabrication process in June, reports Business Korea. Typically, foundries and chip designers never formally announce R&D milestones, so we are unlikely going to see a TSMC press release saying that development of its 1.4 nm technology had been started. Meanwhile, TSMC is set to host its Technology Symposium in mid-June and there the company may outline some brief details about the node that will succeed its N2 manufacturing process.  

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